Thermal Management

Metal substrate / Chip carrier

Standard & Custom designs

● Adjust vertically to match thermal expansion coefficient
● Good Solderability and Bonding, Small size.
● AL2O3, ALN, BeO materials

Submount / Stand-off

Standard & Custom designs

● For height matching, bonding pads & jumpers

● Good Solderability and Bonding
● AL2O3, ALN, BeO materials