Thermal Management

Metal substrate / Chip carrier

 

Standard & Custom designs

 

● Adjust vertically to match thermal expansion coefficient
● Good Solderability and Bonding, Small size.
● AL2O3, ALN, BeO materials

 

Submount / Stand-off

 

Standard & Custom designs

 

● For height matching, bonding pads & jumpers

● Good Solderability and Bonding
● AL2O3, ALN, BeO materials

 

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