DITF has been a trusted supplier of thin film interconnects for over 38 years. Customers have use DITF manufactured interconnects in wireless, fiber optic telecommunication, CATV, commercial, medical, and militarysystems and other critical applications, ranging from DC to in excess of 180GHz operation.

The evolving technical requirements for cost effective interconnect solutions has driven DITF to develop a diverse capability utilizing proven and repeatable processes. Full in-house capability include vacuum deposition, CO2 lasers, electroplating, resistor trimming, diamond dicing, photolithography and many other services.

DITF's process toolkit enables a wide array of circuit design features and structures. With these tools the designer can maximize performance andminimize overall cost.