Ceramic Packages

HTCC QFN

 

DC-40GHz operation

 

● JEDEC MO-220 footprints

● 3mm (12-pins) to 8mm (48-pins) Sizes

● Alumina, AlN Construction

 

● Open Air Cavity

● Bare Seal Ring, Grounded Seal Ring, Grounded Seal Ring with Castellations

 

● Fully hermetically sealable (MIL-STD -883 Test Method 1014)

● RoHS compliant

 

>> Simulation models available

Lids

 

● Unmetallized

● Metallized ring (bottom side)

● Fully metallised (bottom side)

● Metallized Ring (bottom side) with Fully Metallized Top

 

● Epoxy, Sealing glass, Solder attachement options

● RoHS compliant

 

>> Custom designs available

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