Build-to-Print

Thin Film Circuits
Flexible Circuits

Single and multi-layer

 

Processes:

CO2 laser drilling
Sputtering


Photolithography

(feature size to 0.00027" (6.86 um), tolerances to ±0.00005")

 

Electroplating

Electroforming
Electroless Ni/Immersion Au (ENIG),
Pre-deposited & patterned AuSn solder.


Laser trim

(Resistors, attenuators, complex circuits etc)

 

Diamond saw dicing

(parts sizes as small as 0201 devices)

 

Packaging

(bulk, waffle pack, Tape & Reel)

 

Services:

100% visual inspection

(MIL-STD-883)

 

DC & Electrical testing

S-Parameter

 

First Article Inspection (FAI)

Element Eval to MIL-PRF-38534 Class K

 

Microwave packaging and low level assembly

 

Substrates (include):

Quartz/fused silica,

Aluminum nitride,

Alumina,

Ferrite/garnet,

Titanates,

Glass,

Sapphire,

Silico,

Polyimide,

 

Resistor films

(TaN, NiCr)

 

As-fired, lapped, polished

 

Conductive materials (include):

Nickel cobalt,

Nickel,

Copper,

Pure gold,

Hard gold,

Palladium,

Platinum,

Rhodium,

 

Features:

Conductors

(incl high power handling, High-Q, High Conductivity)

 

Resistor
Adhesion


Plated Thru Holes & Filled Vias

(Copper, Gold; Space qualified Cu Filled Vias)


Wrapped Connections
Edge Wraps

Castellation


Solder Barriers &Control

(e.g. TiW, Polyimide, Nickel Oxide)


Supported Bridges

Spiral Inductor

Backside metallization

Thermal management solutions

 

Solder, Epoxy, wire-bond attachements

RoHS

Example components -Coils, Sensors, Electrodes, Optical


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